Using plasma pretreatment for enhancing biomaterial as a printing medium for digital ink-jet printing for cotton fabric

Chi Wai Kan; C.W.M. Yuen; W.Y. Tsoi; C.K. Chan

Using plasma pretreatment for enhancing biomaterial as a printing medium for digital ink-jet printing for cotton fabric

Chi Wai Kan, C.W.M. Yuen, W.Y. Tsoi, C.K. Chan

The Hong Kong Polytechnic University

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Pages	207-210
Number of pages	4
Publication status	Published - 2009
Event	International Symposium on Sputtering and Plasma Processes [ISSP] - Duration: 1 Jan 2009 → …

Conference

Conference	International Symposium on Sputtering and Plasma Processes [ISSP]
Period	1/01/09 → …

Cite this

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title = "Using plasma pretreatment for enhancing biomaterial as a printing medium for digital ink-jet printing for cotton fabric",

author = "Kan, {Chi Wai} and C.W.M. Yuen and W.Y. Tsoi and C.K. Chan",

year = "2009",

language = "English",

pages = "207--210",

note = "International Symposium on Sputtering and Plasma Processes [ISSP] ; Conference date: 01-01-2009",

}

Using plasma pretreatment for enhancing biomaterial as a printing medium for digital ink-jet printing for cotton fabric. / Kan, Chi Wai; Yuen, C.W.M.; Tsoi, W.Y. et al.
2009. 207-210 Paper presented at International Symposium on Sputtering and Plasma Processes [ISSP].

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Using plasma pretreatment for enhancing biomaterial as a printing medium for digital ink-jet printing for cotton fabric

AU - Kan, Chi Wai

AU - Yuen, C.W.M.

AU - Tsoi, W.Y.

AU - Chan, C.K.

PY - 2009

Y1 - 2009

M3 - Conference presentation (not published in journal/proceeding/book)

SP - 207

EP - 210

T2 - International Symposium on Sputtering and Plasma Processes [ISSP]

Y2 - 1 January 2009

ER -