Ultrasonic bonding of semiconductor dies on glass substrates with thermoplastic adhesive tapes

H.C. Wong; S.Y. Wong; Siu Wing Or; Y.M. Cheung; P.K. Choy

Ultrasonic bonding of semiconductor dies on glass substrates with thermoplastic adhesive tapes

H.C. Wong
, S.Y. Wong
, Siu Wing Or
, Y.M. Cheung
, P.K. Choy

The Hong Kong Polytechnic University

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Publication status	Published - 2007
Event	International Symposium on Smart Materials and Devices - Duration: 1 Jan 2007 → …

Conference

Conference	International Symposium on Smart Materials and Devices
Period	1/01/07 → …

Cite this

@conference{282a740bcfdb406297831dee2881cdd1,

title = "Ultrasonic bonding of semiconductor dies on glass substrates with thermoplastic adhesive tapes",

author = "H.C. Wong and S.Y. Wong and Or, \{Siu Wing\} and Y.M. Cheung and P.K. Choy",

year = "2007",

language = "English",

note = "International Symposium on Smart Materials and Devices ; Conference date: 01-01-2007",

}

Ultrasonic bonding of semiconductor dies on glass substrates with thermoplastic adhesive tapes. / Wong, H.C.; Wong, S.Y.; Or, Siu Wing et al.
2007. Paper presented at International Symposium on Smart Materials and Devices.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Ultrasonic bonding of semiconductor dies on glass substrates with thermoplastic adhesive tapes

AU - Wong, H.C.

AU - Wong, S.Y.

AU - Or, Siu Wing

AU - Cheung, Y.M.

AU - Choy, P.K.

PY - 2007

Y1 - 2007

M3 - Conference presentation (not published in journal/proceeding/book)

T2 - International Symposium on Smart Materials and Devices

Y2 - 1 January 2007

ER -