Two-dimensional electrospun nanofibrous membranes for promoting random skin flap survival

Xiaoming Sun, Reila Zheng, Liying Cheng, Xin Zhao, Rong Jin, Lu Zhang, Ying Zhang, Yuguang Zhang, Wenguo Cui

Research output: Journal article publicationJournal articleAcademic researchpeer-review

15 Citations (Scopus)

Abstract

Random skin flaps are widely used for repairing and reconstructing tissue defects and local tissue loss, and efforts to improve the survival of random skin flaps are continually being developed. Biomaterial scaffolds provide a microstructure for cell growth. However, the conventional three-dimensional structure can cause large foreign body reactions in the local subcutaneous tissue leading to fibrosis in order to block the blood perfusion of the skin flap. In this study, the effect of two-dimensional electrospun nanofibrous membranes on random skin flaps survival was investigated. Both typical nanofibrous membranes of synthetic (poly(l-lactide)) and natural (gelatin) materials were fabricated and analyzed using scanning electron microscopy, uniaxial tensile and water contact angle measurements. Both kinds of membranes maintained stable fibrous structures, but the natural fiber showed a better adhesion and viability for human dermal fibroblasts (HDFs) and human umbilical vein endothelial cells (HUVECs) compared to synthetic fibers. In vivo experiments showed that natural electrospun nanofibrous membranes had faster degradation, better revascularization, and caused less inflammation, leading to an improved random skin flap survival. Therefore, electrospun fibrous membranes made of natural materials are more advantageous for random skin flap survival compared to the synthetic ones, and may be used as carrier implantation materials for improving skin flap survival rate.
Original languageEnglish
Pages (from-to)9360-9369
Number of pages10
JournalRSC Advances
Volume6
Issue number11
DOIs
Publication statusPublished - 1 Jan 2016
Externally publishedYes

ASJC Scopus subject areas

  • Chemistry(all)
  • Chemical Engineering(all)

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