Tuning deformation behavior of Cu0.5CoNiCrAl high-entropy alloy via cooling rate gradient: An atomistic study

Shidong Feng, Lin Li, K. C. Chan, Lei Zhao, Shaopeng Pan, Limin Wang, Riping Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

6 Citations (Scopus)

Abstract

The deformation behaviors of body-centered cubic Cu0.5CoNiCrAl high-entropy alloys processed by the cooling rate gradient are investigated by the molecular dynamics simulations. The plastic deformation ability of the high-entropy alloy is significantly improved by triggering multiple-type dislocation slips along different deformation paths. The cooling rate gradient introduces abundant atomic vacancies, proliferating the nucleation sites of dislocations. Additionally, the nucleation barriers of dislocations are reduced by the resultant structural disorder, high potential energy and chemical segregation. Consequently, the cooling rate gradient enhances the structural heterogeneity, promoting the formation of multiple deformation paths and preventing strain localization.

Original languageEnglish
Article number106553
JournalIntermetallics
Volume112
DOIs
Publication statusPublished - Sep 2019

Keywords

  • A. High–entropy alloys
  • B. Dislocation structure
  • D. Grain boundary
  • D. Microstructure
  • D. Plastic deformation unit
  • E. Molecular dynamic simulation

ASJC Scopus subject areas

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Cite this