Transfer imprint lithography using a soft mold

J. Z. Xin, F. K. Lee, S. Y W Li, K. S. Chan, H. L W Chan, Chi Wah Leung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

5 Citations (Scopus)

Abstract

In order to simplify the nanoimprint process and allow thick metal sacrificial layer deposition for high-aspect-ratio etching, a transfer imprint lithography technique is introduced. A metal layer is deposited on PDMS mold, and it is subsequently imprinted against an uncured nanoimprint resist layer spin coated on the substrate. The curing of nanoimprint resist by UV exposure naturally provides adhesion between the metal and substrate. The use of soft PDMS mold generates conformal contact of patterns with target surfaces and greatly reduces the imprinting pressure required for homogenous mask transfer.
Original languageEnglish
Pages (from-to)2632-2635
Number of pages4
JournalMicroelectronic Engineering
Volume88
Issue number8
DOIs
Publication statusPublished - 1 Aug 2011

Keywords

  • Imprinting
  • Metal pattern transfer
  • PDMS
  • Soft mold

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics

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