Towards future VLSI interconnects using aligned carbon nanotubes

Yang Chai; Minghui Sun; Zhiyong Xiao; Yuan Li; Min Zhang; Philip Ching Ho Chan

doi:10.1109/VLSISoC.2011.6081646

Towards future VLSI interconnects using aligned carbon nanotubes

Yang Chai, Minghui Sun, Zhiyong Xiao, Yuan Li, Min Zhang, Philip Ching Ho Chan

The Hong Kong Polytechnic University

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

6 Citations (Scopus)

Abstract

The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size continues to scale down to nanoscale. Theoretical works predicted that carbon nanotube (CNT) is more superior than copper for future VLSI interconnects in terms of electrical conductivity, thermal management and reliability. Technology breakthroughs are required to bridge the gaps between the theoretical predictions and what is achievable with current CNT technology. In this paper, we shall describe our experimental efforts on the controlled growth of aligned CNTs; the integrations of CNT interconnects with IC technology; and the electrical characterization of the CNT interconnect. We also present the electro-migration test result of CNT-based interconnects to demonstrate the potential of CNT as robust VLSI interconnects. We hope our works provide useful data on the potential of CNT for VLSI interconnect applications.

Original language	English
Title of host publication	2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
Pages	248-253
Number of pages	6
DOIs	https://doi.org/10.1109/VLSISoC.2011.6081646
Publication status	Published - 22 Dec 2011
Event	2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011 - Kowloon, Hong Kong Duration: 3 Oct 2011 → 5 Oct 2011

Conference

Conference	2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011
Country/Territory	Hong Kong
City	Kowloon
Period	3/10/11 → 5/10/11

Keywords

breakdown
carbon nanotube (CNT)
chemical vapor deposition (CVD)
contact resistance
copper (Cu)
electro-migration (EM)
interconnect
interface
reliability

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

More information

10.1109/VLSISoC.2011.6081646

Cite this

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title = "Towards future VLSI interconnects using aligned carbon nanotubes",

abstract = "The copper interconnects cannot keep pace with the IC interconnect requirements as the feature size continues to scale down to nanoscale. Theoretical works predicted that carbon nanotube (CNT) is more superior than copper for future VLSI interconnects in terms of electrical conductivity, thermal management and reliability. Technology breakthroughs are required to bridge the gaps between the theoretical predictions and what is achievable with current CNT technology. In this paper, we shall describe our experimental efforts on the controlled growth of aligned CNTs; the integrations of CNT interconnects with IC technology; and the electrical characterization of the CNT interconnect. We also present the electro-migration test result of CNT-based interconnects to demonstrate the potential of CNT as robust VLSI interconnects. We hope our works provide useful data on the potential of CNT for VLSI interconnect applications.",

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Chai, Y, Sun, M, Xiao, Z, Li, Y, Zhang, M & Chan, PCH 2011, Towards future VLSI interconnects using aligned carbon nanotubes. in 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011., 6081646, pp. 248-253, 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011, Kowloon, Hong Kong, 3/10/11. https://doi.org/10.1109/VLSISoC.2011.6081646

Towards future VLSI interconnects using aligned carbon nanotubes. / Chai, Yang; Sun, Minghui; Xiao, Zhiyong et al.
2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip, VLSI-SoC 2011. 2011. p. 248-253 6081646.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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Towards future VLSI interconnects using aligned carbon nanotubes

Abstract

Conference

Keywords

ASJC Scopus subject areas

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