Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations

Xusheng Yang, Yun Jiang Wang, Hui Ru Zhai, Guo Yong Wang, Yan Jing Su, L. H. Dai, Shigenobu Ogata, Tong Yi Zhang

Research output: Journal article publicationJournal articleAcademic researchpeer-review

30 Citations (Scopus)

Abstract

In the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 °C (RT), 40 °C, 50 °C, 60 °C, and 70 °C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinning could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper.
Original languageEnglish
Pages (from-to)191-206
Number of pages16
JournalJournal of the Mechanics and Physics of Solids
Volume94
DOIs
Publication statusPublished - 1 Sep 2016
Externally publishedYes

Keywords

  • Activation parameters
  • Atomistic simulations
  • Creep
  • HRTEM
  • Nanotwin

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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