TY - GEN
T1 - Three dimensional palmprint recognition
AU - Li, Wei
AU - Zhang, Lei
AU - Zhang, Dapeng
PY - 2009/12/1
Y1 - 2009/12/1
N2 - Palmprint has been widely studied as its high accuracy and low cost. Most of the previous studies are based on two dimensional (2D) image of the palmprint. However, 2D image can be easily forged, which will threaten the security of palmprint authentication system. Furthermore, 2D image can be easily affected by noise, such as scrabbling and dirty in the palm. To overcome these shortcomings, we develop a three dimensional (3D) palmprint identification system. The structured-light imaging technology is adopted to collect the 3D palmprint data, from which the stable Mean Curvature Image (MCI) is extracted. Then the Competitive Coding (CompCode) technique is used to code the 3D palmprint pattern according the MCI. By using score level fusion of MCI and its CompCode, promising recognition performance is achieved on our established 3D palmprint database.
AB - Palmprint has been widely studied as its high accuracy and low cost. Most of the previous studies are based on two dimensional (2D) image of the palmprint. However, 2D image can be easily forged, which will threaten the security of palmprint authentication system. Furthermore, 2D image can be easily affected by noise, such as scrabbling and dirty in the palm. To overcome these shortcomings, we develop a three dimensional (3D) palmprint identification system. The structured-light imaging technology is adopted to collect the 3D palmprint data, from which the stable Mean Curvature Image (MCI) is extracted. Then the Competitive Coding (CompCode) technique is used to code the 3D palmprint pattern according the MCI. By using score level fusion of MCI and its CompCode, promising recognition performance is achieved on our established 3D palmprint database.
KW - 3D palmprint identification
KW - Biometrics
KW - Feature coding
KW - Mean curvature
UR - http://www.scopus.com/inward/record.url?scp=74849128893&partnerID=8YFLogxK
U2 - 10.1109/ICSMC.2009.5346053
DO - 10.1109/ICSMC.2009.5346053
M3 - Conference article published in proceeding or book
SN - 9781424427949
SP - 4847
EP - 4852
BT - Proceedings 2009 IEEE International Conference on Systems, Man and Cybernetics, SMC 2009
T2 - 2009 IEEE International Conference on Systems, Man and Cybernetics, SMC 2009
Y2 - 11 October 2009 through 14 October 2009
ER -