Three-dimensional coupled conduction-convection problem for three chips mounted on a substrate in an enclosure

The coupled heat conduction / convection problem for three heated chips mounted on a conductive substrate in a three–dimensional enclosure filled with air is solved by an operator–splitting pseudo–time–stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux, The main feature of the solution procedure is that the multiphases are treated as a single computational domain with unknown interfacial boundary conditions. The temperature distribution in the chips, in the substrate, and in the surrounding air, together with the connective flow pattern are obtained simultaneously. A maximum dimensionless temperature correlation is developed and can successfully predict the maximum temperature in heat sources, which provides a useful tool for the electronic designer.