Thermomigration and electromigration in Sn8Zn3Bi solder joints

X. Gu, Kam Chuen Yung, Y. C. Chan, D. Yang

Research output: Journal article publicationJournal articleAcademic researchpeer-review

19 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Thermomigration and electromigration in Sn8Zn3Bi solder joints'. Together they form a unique fingerprint.

Keyphrases

Material Science