Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials

Qing Hua Qin, Yiu Wing Mai

Research output: Journal article publicationJournal articleAcademic researchpeer-review

47 Citations (Scopus)

Abstract

For a two-dimensional piezoelectric plate, the thermoelectroelastic Green's functions for bimaterials subjected to a temperature discontinuity are presented by way of Stroh formalism. The study shows that the thermoelectroelastic Green's functions for bimaterials are composed of a particular solution and a corrective solution. All the solutions have their singularities, located at the point applied by the dislocation, as well as some image singularities, located at both the lower and the upper half-plane. Using the proposed thermoelectroelastic Green's functions, the problem of a crack of arbitrary orientation near a bimaterial interface between dissimilar thermopiezoelectric material is analysed, and a system of singular integral equations for the unknown temperature discontinuity, defined on the crack faces, is obtained. The stress and electric displacement (SED) intensity factors and strain energy density factor can be, then, evaluated by a numerical solution at the singular integral equations. As a consequence, the direction of crack growth can be estimated by way of strain energy density theory. Numerical results for the fracture angle are obtained to illustrate the application of the proposed formulation.

Original languageEnglish
Pages (from-to)433-444
Number of pages12
JournalArchive of Applied Mechanics
Volume68
Issue number6
DOIs
Publication statusPublished - Jul 1998
Externally publishedYes

Keywords

  • Bimaterial
  • Crack
  • Green function
  • Interface
  • Piezoelectric plate
  • Thermal stress

ASJC Scopus subject areas

  • Mechanical Engineering

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