Thermo-mechanical simulation of PIM thermal debinding

Y. Shengjie, Y.C. Lam, Ching Man Yu, K.C. Tam

Research output: Journal article publicationLiterature reviewAcademic researchpeer-review

8 Citations (Scopus)

Abstract

A two-dimensional simulation of thermal dabinding in powder injection molding is presented. Special interest is placed on deformation and stress generation due to polymer removal by thermal debinding. The strains and stresses arising from polymer content change, gas pressure, and temperature change are considered. The simulated results reveal that the strain and stress in the compact are dominated primarily by polymer content change. The nonuniform distribution of polymer content during the polymer removal process is attributed to nonuniform flow of the polymer; attendant nonuniform deformation and stresses in the compact can lead to failure.
Original languageEnglish
Pages (from-to)41-55
Number of pages15
JournalInternational Journal of Powder Metallurgy (Princeton, New Jersey)
Volume38
Issue number8
Publication statusPublished - 1 Nov 2002
Externally publishedYes

ASJC Scopus subject areas

  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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