Thermal wave probe microscopy for materials characterization

M. B. Suddendorf, Michael Geoffrey Somekh, M. Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

1 Citation (Scopus)

Abstract

A system capable of measuring photoreflectance and phoiodisplacement phenomena simultaneously is described. Results are presented showing the imaging performance of the system, and the applications to semiconductor and thin-film characterization are discussed.
Original languageEnglish
Pages (from-to)71-76
Number of pages6
JournalInternational Journal of Electronics
Volume77
Issue number1
DOIs
Publication statusPublished - 1 Jan 1994
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Thermal wave probe microscopy for materials characterization'. Together they form a unique fingerprint.

Cite this