Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

J. H. Park; J. K. Kim; M. M.F. Yuen; S. W.R. Lee; P. Tong; Philip Ching Ho Chan

Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

J. H. Park, J. K. Kim, M. M.F. Yuen, S. W.R. Lee, P. Tong, Philip Ching Ho Chan

Research output: Journal article publication › Review article › Academic research › peer-review

Abstract

Numerical models are developed to evaluate the thermal residual stresses arising from the differential thermal expansion between the plastic package constituents. A parametric study is performed using linear-elastic and viscoelastic properties for the encapsulant material. The comparison with the experimental stress chip measurements suggests that the model calculated based on the viscoelastic encapsulant predicts the stress profiles more accurately than the linear-elastic counterpart.

Original language	English
Pages (from-to)	1127-1132
Number of pages	6
Journal	Key Engineering Materials
Issue number	149 PART II
Publication status	Published - 1 Dec 1998
Externally published	Yes

Keywords

Failure Mechanisms
Finite Element Analysis
PQFP
Residual Thermal Stresses
Viscoelastic Moulding Compound

ASJC Scopus subject areas

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

Cite this

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title = "Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models",

abstract = "Numerical models are developed to evaluate the thermal residual stresses arising from the differential thermal expansion between the plastic package constituents. A parametric study is performed using linear-elastic and viscoelastic properties for the encapsulant material. The comparison with the experimental stress chip measurements suggests that the model calculated based on the viscoelastic encapsulant predicts the stress profiles more accurately than the linear-elastic counterpart.",

keywords = "Failure Mechanisms, Finite Element Analysis, PQFP, Residual Thermal Stresses, Viscoelastic Moulding Compound",

author = "Park, {J. H.} and Kim, {J. K.} and Yuen, {M. M.F.} and Lee, {S. W.R.} and P. Tong and Chan, {Philip Ching Ho}",

year = "1998",

month = dec,

day = "1",

language = "English",

pages = "1127--1132",

journal = "Key Engineering Materials",

issn = "1013-9826",

publisher = "Trans Tech Publications",

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T1 - Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

AU - Park, J. H.

AU - Kim, J. K.

AU - Yuen, M. M.F.

AU - Lee, S. W.R.

AU - Tong, P.

AU - Chan, Philip Ching Ho

PY - 1998/12/1

Y1 - 1998/12/1

N2 - Numerical models are developed to evaluate the thermal residual stresses arising from the differential thermal expansion between the plastic package constituents. A parametric study is performed using linear-elastic and viscoelastic properties for the encapsulant material. The comparison with the experimental stress chip measurements suggests that the model calculated based on the viscoelastic encapsulant predicts the stress profiles more accurately than the linear-elastic counterpart.

AB - Numerical models are developed to evaluate the thermal residual stresses arising from the differential thermal expansion between the plastic package constituents. A parametric study is performed using linear-elastic and viscoelastic properties for the encapsulant material. The comparison with the experimental stress chip measurements suggests that the model calculated based on the viscoelastic encapsulant predicts the stress profiles more accurately than the linear-elastic counterpart.

KW - Failure Mechanisms

KW - Finite Element Analysis

KW - PQFP

KW - Residual Thermal Stresses

KW - Viscoelastic Moulding Compound

UR - http://www.scopus.com/inward/record.url?scp=0037802677&partnerID=8YFLogxK

M3 - Review article

SN - 1013-9826

SP - 1127

EP - 1132

JO - Key Engineering Materials

JF - Key Engineering Materials

IS - 149 PART II

ER -

Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

Abstract

Keywords

ASJC Scopus subject areas

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