Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

J. H. Park, J. K. Kim, M. M.F. Yuen, S. W.R. Lee, P. Tong, Philip Ching Ho Chan

Research output: Journal article publicationReview articleAcademic researchpeer-review

16 Citations (Scopus)


Numerical models are developed to evaluate the thermal residual stresses arising from the differential thermal expansion between the plastic package constituents. A parametric study is performed using linear-elastic and viscoelastic properties for the encapsulant material. The comparison with the experimental stress chip measurements suggests that the model calculated based on the viscoelastic encapsulant predicts the stress profiles more accurately than the linear-elastic counterpart.
Original languageEnglish
Pages (from-to)1127-1132
Number of pages6
JournalKey Engineering Materials
Issue number149 PART II
Publication statusPublished - 1 Dec 1998
Externally publishedYes


  • Failure Mechanisms
  • Finite Element Analysis
  • PQFP
  • Residual Thermal Stresses
  • Viscoelastic Moulding Compound

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this