Thermal Sensing Using Micro-ring Resonators in Optical Network-on-Chip

Weichen Liu, Mengquan Li, Wanli Chang, Chunhua Xiao, Yiyuan Xie, Nan Guan, Lei Jiang

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

4 Citations (Scopus)

Abstract

In this paper, we for the first time utilize the micro-ring resonators (MRs) in optical networks-on-chip (ONoCs) to implement thermal sensing without requiring additional hardware or chip area. The challenges in accuracy and reliability that arise from fabrication-induced process variations (PVs) and device-level wavelength tuning mechanism are resolved. We quantitatively model the intrinsic thermal sensitivity of MRs with finegrained consideration of wavelength tuning mechanism. Based on it, a novel PV-tolerant thermal sensor design is proposed. By exploiting the hidden 'redundancy' in wavelength division multiplexing (WDM) technique, our sensor achieves accurate and efficient temperature measurement with the capability of PV tolerance. Evaluation results based on professional photonic component and circuit simulations show an average of 86.49% improvement in measurement accuracy compared to the state-of-the-art on-chip thermal sensing approach using MRs. Our thermal sensor achieves stable performance in the ONoCs employing dense WDM with an inaccuracy of only 0.8650 K.

Original languageEnglish
Title of host publicationProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1611-1614
Number of pages4
ISBN (Electronic)9783981926323
DOIs
Publication statusPublished - 14 May 2019
Event22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019 - Florence, Italy
Duration: 25 Mar 201929 Mar 2019

Publication series

NameProceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019

Conference

Conference22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
CountryItaly
CityFlorence
Period25/03/1929/03/19

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Control and Optimization

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