TY - GEN
T1 - Thermal Sensing Using Micro-ring Resonators in Optical Network-on-Chip
AU - Liu, Weichen
AU - Li, Mengquan
AU - Chang, Wanli
AU - Xiao, Chunhua
AU - Xie, Yiyuan
AU - Guan, Nan
AU - Jiang, Lei
PY - 2019/5/14
Y1 - 2019/5/14
N2 - In this paper, we for the first time utilize the micro-ring resonators (MRs) in optical networks-on-chip (ONoCs) to implement thermal sensing without requiring additional hardware or chip area. The challenges in accuracy and reliability that arise from fabrication-induced process variations (PVs) and device-level wavelength tuning mechanism are resolved. We quantitatively model the intrinsic thermal sensitivity of MRs with finegrained consideration of wavelength tuning mechanism. Based on it, a novel PV-tolerant thermal sensor design is proposed. By exploiting the hidden 'redundancy' in wavelength division multiplexing (WDM) technique, our sensor achieves accurate and efficient temperature measurement with the capability of PV tolerance. Evaluation results based on professional photonic component and circuit simulations show an average of 86.49% improvement in measurement accuracy compared to the state-of-the-art on-chip thermal sensing approach using MRs. Our thermal sensor achieves stable performance in the ONoCs employing dense WDM with an inaccuracy of only 0.8650 K.
AB - In this paper, we for the first time utilize the micro-ring resonators (MRs) in optical networks-on-chip (ONoCs) to implement thermal sensing without requiring additional hardware or chip area. The challenges in accuracy and reliability that arise from fabrication-induced process variations (PVs) and device-level wavelength tuning mechanism are resolved. We quantitatively model the intrinsic thermal sensitivity of MRs with finegrained consideration of wavelength tuning mechanism. Based on it, a novel PV-tolerant thermal sensor design is proposed. By exploiting the hidden 'redundancy' in wavelength division multiplexing (WDM) technique, our sensor achieves accurate and efficient temperature measurement with the capability of PV tolerance. Evaluation results based on professional photonic component and circuit simulations show an average of 86.49% improvement in measurement accuracy compared to the state-of-the-art on-chip thermal sensing approach using MRs. Our thermal sensor achieves stable performance in the ONoCs employing dense WDM with an inaccuracy of only 0.8650 K.
UR - http://www.scopus.com/inward/record.url?scp=85066634397&partnerID=8YFLogxK
U2 - 10.23919/DATE.2019.8714844
DO - 10.23919/DATE.2019.8714844
M3 - Conference article published in proceeding or book
AN - SCOPUS:85066634397
T3 - Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
SP - 1611
EP - 1614
BT - Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd Design, Automation and Test in Europe Conference and Exhibition, DATE 2019
Y2 - 25 March 2019 through 29 March 2019
ER -