Thermal performance and placement design of LED array package on PCB

Kam Chuen Yung, H. M. Liem, H. S. Choy

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

4 Citations (Scopus)

Abstract

This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a metal core printed circuit board (MCPCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD) were performed according to the practical working conditions of the LED array. The surface temperatures of the LEDs having the developed placement method were monitored and compared with that of LEDs using a conventional placement method. Emphasis was placed upon investigating how the radiant flux, efficacy, and uniformity of illuminance changed in accordance with the method. Thermal distribution of a commercial LED product having 36 high-brightness LEDs using the developed placement method is compared to that of the LED product having the original design. Results suggested that the new placement method could lower the individual LED surface temperature by rearranging the thermal distribution of the LED array. As a result, the overall heat dissipating capability of the LED array to the PCB and hence LED efficacy was improved.
Original languageEnglish
Title of host publication14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs
Publication statusPublished - 1 Dec 2012
Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
Duration: 13 Dec 201216 Dec 2012

Conference

Conference14th International Conference on Electronic Materials and Packaging, EMAP 2012
CountryHong Kong
CityLantau Island
Period13/12/1216/12/12

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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