Abstract
A detailed thermal modeling study of the micromachined micro-hotplate (MHP) using three-dimensional finite element analysis was presented. Three MHP structures were analyzed. Their thermal characteristics were compared. The three MHP structures considered were the suspended MHP, suspended MHP with pillar and bulk sensor. In the suspended MHP, the silicon surrounding the MHP is completely etched away. In the suspended MHP with pillar, the silicon is partially etched and the MHP is supported by a silicon pillar with diameter of about 1/20 of the MHP area from underneath. The bulk sensor without silicon etch serves as a control. In order to reduce the node number and the problem size, quarter symmetry was used. Layout of the die was simplified.
Original language | English |
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Title of host publication | Proceedings of the IEEE Hong Kong Electron Devices Meeting |
Publisher | IEEE |
Pages | 149-152 |
Number of pages | 4 |
Publication status | Published - 1 Dec 1997 |
Externally published | Yes |
Event | Proceedings of the 1997 IEEE Hong Kong Electron Devices Meeting - Hong Kong, Hong Kong Duration: 30 Aug 1997 → 30 Aug 1997 |
Conference
Conference | Proceedings of the 1997 IEEE Hong Kong Electron Devices Meeting |
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Country/Territory | Hong Kong |
City | Hong Kong |
Period | 30/08/97 → 30/08/97 |
ASJC Scopus subject areas
- General Engineering