Thermal modeling of micro-hotplates for integrated sensor applications

Darwin T W Wong, Philip Ching Ho Chan, Lie yi Sheng, Johnny K O Sin

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

4 Citations (Scopus)

Abstract

A detailed thermal modeling study of the micromachined micro-hotplate (MHP) using three-dimensional finite element analysis was presented. Three MHP structures were analyzed. Their thermal characteristics were compared. The three MHP structures considered were the suspended MHP, suspended MHP with pillar and bulk sensor. In the suspended MHP, the silicon surrounding the MHP is completely etched away. In the suspended MHP with pillar, the silicon is partially etched and the MHP is supported by a silicon pillar with diameter of about 1/20 of the MHP area from underneath. The bulk sensor without silicon etch serves as a control. In order to reduce the node number and the problem size, quarter symmetry was used. Layout of the die was simplified.
Original languageEnglish
Title of host publicationProceedings of the IEEE Hong Kong Electron Devices Meeting
PublisherIEEE
Pages149-152
Number of pages4
Publication statusPublished - 1 Dec 1997
Externally publishedYes
EventProceedings of the 1997 IEEE Hong Kong Electron Devices Meeting - Hong Kong, Hong Kong
Duration: 30 Aug 199730 Aug 1997

Conference

ConferenceProceedings of the 1997 IEEE Hong Kong Electron Devices Meeting
Country/TerritoryHong Kong
CityHong Kong
Period30/08/9730/08/97

ASJC Scopus subject areas

  • Engineering(all)

Cite this