@inproceedings{c49db57cb20a418c87de48fefb90bdb4,
title = "Thermal management and alignment strategies in MEMS tunable laser packaging",
abstract = "A packaging architecture is developed for MEMS tunable laser (MEMS-TL). The hybrid integration of chips is realized under high accuracy thermal control and precise alignment. The thermal conductivity of the laser chip has been improved up to 60% by the proper substrate design of device and epi-down bonding method. Under the analysis of heat flux, we employ a thermoelectric cooler (TEC) to stabilize the temperature. The substrate is designed to accommodate gain chips with minimal active optical alignment, thus reducing the packaging cost. With this packaging scheme, the insertion loss is greatly induced less than 1 dB due to the advantages of horizontal and vertical alignment in optical fiber fastening and laser diode bonding.",
keywords = "MEMS, Optical alignment, Packaging, Thermal management, Tunable laser",
author = "Fang, {Tao Ji} and Jonathan Tamil and Wu Jian and Xu Kun and Tong, {Lin Jin} and Qun, {Liu Ai}",
year = "2009",
month = jun,
doi = "10.4028/www.scientific.net/AMR.74.319",
language = "English",
isbn = "0878493212",
series = "Advanced Materials Research",
pages = "319--322",
booktitle = "NEMS/MEMS Technology and Devices - Selected, peer reviewed papers from the International Conference on Materials for Advanced Technologies 2009, ICMAT 2009",
note = "International Conference on Materials for Advanced Technologies, ICMAT 2009 ; Conference date: 28-06-2009 Through 03-07-2009",
}