Thermal analysis of silicon micromachining based micro hotplates

Juan Yu, Zhen'an Tang, Philip Ching Ho Chan, Guangfen Wei, Liding Wang, Guizhen Yan

Research output: Journal article publicationJournal articleAcademic researchpeer-review

6 Citations (Scopus)


Thermal simulation of three types of MHPs (surface micro-machined, back-side bulk silicon micro-machined, and front-side bulk silicon micro-machined) working in atmosphere and vacuum is performed with 3D FEA. Their first two types of MHPs are fabricated and their experimental results are in agreement with the FEA. It is shown that, power consumption of the surface micromachined MHP is smaller than the back-side bulk silicon micromachined MHP in vacuum; however, in atmosphere, thermal conduction of the thin air layer in the surface micro-machined MHP dramatically increases its power consumption, with is much larger than that of the back-side bulk silicon micromachined MHP.
Original languageEnglish
Pages (from-to)192-196
Number of pages5
JournalPan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
Issue number1
Publication statusPublished - 1 Jan 2005
Externally publishedYes


  • Finite element analysis
  • Heat conduction
  • Micro hotplate
  • Silicon micromachining

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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