Abstract
Thermal simulation of three types of MHPs (surface micro-machined, back-side bulk silicon micro-machined, and front-side bulk silicon micro-machined) working in atmosphere and vacuum is performed with 3D FEA. Their first two types of MHPs are fabricated and their experimental results are in agreement with the FEA. It is shown that, power consumption of the surface micromachined MHP is smaller than the back-side bulk silicon micromachined MHP in vacuum; however, in atmosphere, thermal conduction of the thin air layer in the surface micro-machined MHP dramatically increases its power consumption, with is much larger than that of the back-side bulk silicon micromachined MHP.
| Original language | English |
|---|---|
| Pages (from-to) | 192-196 |
| Number of pages | 5 |
| Journal | Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors |
| Volume | 26 |
| Issue number | 1 |
| Publication status | Published - 1 Jan 2005 |
| Externally published | Yes |
Keywords
- Finite element analysis
- Heat conduction
- Micro hotplate
- Silicon micromachining
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering