The quality and reliability of fine circuit lines fabricated by the laser structuring technique

B. Zhang, Kam Chuen Yung

Research output: Journal article publicationJournal articleAcademic research


With the decrease in the size of fine circuit lines/spaces, some problems may emerge such as the lack of continuity in the fine circuit lines and poor insulation between circuit lines. These quality and reliability problems are also related to the fabrication process. Laser structuring, a new technique, is used in the fabrication of fine circuit lines/spaces in this work. Fine circuit lines/spaces fabricated in this technique will be tested in an electrical test, a peel test and a surface insulation test. The minimum lines/spaces with good quality and reliability in our research is 25/45µm. These test results will drive the further development and wider usage of the laser structuring technique.
Original languageEnglish
Pages (from-to)10-19
Number of pages10
JournalIndustrial engineering research
Issue number1
Publication statusPublished - 2006


  • Laser structuring
  • Fine circuit lines
  • Surface resistance test
  • Peel test
  • Open/short test

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