The process modelling of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals

C. K W Ip, Chun Kit Kwong, H. Bai, Y. C. Tsim

Research output: Journal article publicationJournal articleAcademic researchpeer-review

23 Citations (Scopus)


Epoxy dispensing is a popular way to perform microchip encapsulation for chip-on-board (COB) packages. However, the determination of the proper process parameters setting for a satisfactory encapsulation quality is difficult due to the complex behaviour of the encapsulant during the dispensing process and the inherent fuzziness of epoxy dispensing systems. Sometimes, the observed values from the process may be irregular. In conventional regression models, deviations between the observed values and the estimated values are supposed to have a probability distribution. However, when data is scattered, the obtained regression model has too wide of a possibility range. These deviations in processes such as epoxy dispensing can be regarded as system fuzziness that can be dealt with satisfactorily using a fuzzy regression method. In this paper, the fuzzy linear regression concept with fuzzy intervals and its application to the process modelling of epoxy dispensing for microchip encapsulation are described. Two fuzzy regression models, expressing the correlation between various process parameters and the two quality characteristics, respectively, were developed. Validation experiments were performed to demonstrate the effectiveness of the method for process modelling.
Original languageEnglish
Pages (from-to)417-423
Number of pages7
JournalInternational Journal of Advanced Manufacturing Technology
Issue number5-6
Publication statusPublished - 1 Dec 2003


  • Epoxy dispensing
  • Fuzzy linear regression
  • Microchip encapsulation
  • Process modelling

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Mechanical Engineering
  • Computer Science Applications
  • Industrial and Manufacturing Engineering

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