Abstract
The constantly growing demand for accuracy, efficiency, dependency, and universality in the simulation and circuit modeling of any functional electromagnetic structure-whether devices, circuits, antennas, interconnects, or packaging [1]-[5]-has for decades been the driving force in the development of a number of successful electromagnetic simulation and circuit modeling packages available on the commercial market. In particular, the current trend toward high-density integrations of electromagnetic geometries, from composite-material-based electrical aircraft to nanomaterial-structured electromagnetic sensors, is spurring thedevelopment of various sophisticated multiscale and multiphysics algorithms for rigorous field simulations and design modeling.
| Original language | English |
|---|---|
| Article number | 7423875 |
| Pages (from-to) | 77-92 |
| Number of pages | 16 |
| Journal | IEEE Microwave Magazine |
| Volume | 17 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 1 Apr 2016 |
ASJC Scopus subject areas
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering
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