The interface behavior of micro overmolding

Hang Liu, Yan Xu, Kai Leung Yung, Chun Lei Kang

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

Micro overmolding is becoming more important with the rapid development and applications of microproducts in bioengineering, electronics and other areas in recent years. This paper presents our findings in studying polymer interfaces in micro channels of a micro mold during overmolding process. The bonding strengths between polycarbonate (PC) and thermoplastic polyurethanes (TPU) were examined and compared under different overmolding conditions. Results show bonding behaviors in micro channels are not only affected by temperatures, they are also influenced by surface roughness.
Original languageEnglish
Title of host publicationManufacturing Engineering and Automation II
Pages896-899
Number of pages4
DOIs
Publication statusPublished - 19 Dec 2012
Event2012 International Conference on Manufacturing Engineering and Automation, ICMEA 2012 - Guangzhou, China
Duration: 16 Nov 201218 Nov 2012

Publication series

NameAdvanced Materials Research
Volume591-593
ISSN (Print)1022-6680

Conference

Conference2012 International Conference on Manufacturing Engineering and Automation, ICMEA 2012
CountryChina
CityGuangzhou
Period16/11/1218/11/12

Keywords

  • Bonding strength
  • Interface
  • Micro overmolding
  • Microfeature
  • Plastics

ASJC Scopus subject areas

  • Engineering(all)

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