The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Asit Kumar Gain, Tama Fouzder, Y. C. Chan, A. Sharif, N. B. Wong, Kam Chuen Yung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

86 Citations (Scopus)

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Material Science