The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture

Kam Chuen Yung; Kang Cheung Chan; Tai Man Yue; K. F. Yeung

doi:10.1007/s00170-003-1667-1

The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture

Kam Chuen Yung, Kang Cheung Chan, Tai Man Yue, K. F. Yeung

Research output: Journal article publication › Journal article › Academic research › peer-review

8 Citations (Scopus)

Abstract

The application of microvias is to reduce the size and weight of the printed circuit board, and to enhance its electrical performance. In many instances, the plating of microvias creates a bottleneck for High Density Interconnection (HDI) manufacture. In this study, the effects of waveform on the copper plating process were investigated. The results showed that the addition of a spike, and a decrease in forward current can improve the throwing power in plating quality. The study also found that the combination of multiple spikes, a low forward current and a high reverse current can significantly improve copper distribution in microvias plating.

Original language	English
Pages (from-to)	245-248
Number of pages	4
Journal	International Journal of Advanced Manufacturing Technology
Volume	23
Issue number	3-4
DOIs	https://doi.org/10.1007/s00170-003-1667-1
Publication status	Published - 1 Jan 2004

Keywords

Microvia
Printed circuit boards
Pulse plating
Throwing power
Waveform

ASJC Scopus subject areas

Control and Systems Engineering
Software
Mechanical Engineering
Computer Science Applications
Industrial and Manufacturing Engineering

More information

10.1007/s00170-003-1667-1

Cite this

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title = "The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture",

abstract = "The application of microvias is to reduce the size and weight of the printed circuit board, and to enhance its electrical performance. In many instances, the plating of microvias creates a bottleneck for High Density Interconnection (HDI) manufacture. In this study, the effects of waveform on the copper plating process were investigated. The results showed that the addition of a spike, and a decrease in forward current can improve the throwing power in plating quality. The study also found that the combination of multiple spikes, a low forward current and a high reverse current can significantly improve copper distribution in microvias plating.",

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AU - Yung, Kam Chuen

AU - Chan, Kang Cheung

AU - Yue, Tai Man

AU - Yeung, K. F.

PY - 2004/1/1

Y1 - 2004/1/1

N2 - The application of microvias is to reduce the size and weight of the printed circuit board, and to enhance its electrical performance. In many instances, the plating of microvias creates a bottleneck for High Density Interconnection (HDI) manufacture. In this study, the effects of waveform on the copper plating process were investigated. The results showed that the addition of a spike, and a decrease in forward current can improve the throwing power in plating quality. The study also found that the combination of multiple spikes, a low forward current and a high reverse current can significantly improve copper distribution in microvias plating.

AB - The application of microvias is to reduce the size and weight of the printed circuit board, and to enhance its electrical performance. In many instances, the plating of microvias creates a bottleneck for High Density Interconnection (HDI) manufacture. In this study, the effects of waveform on the copper plating process were investigated. The results showed that the addition of a spike, and a decrease in forward current can improve the throwing power in plating quality. The study also found that the combination of multiple spikes, a low forward current and a high reverse current can significantly improve copper distribution in microvias plating.

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KW - Printed circuit boards

KW - Pulse plating

KW - Throwing power

KW - Waveform

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JO - International Journal of Advanced Manufacturing Technology

JF - International Journal of Advanced Manufacturing Technology

IS - 3-4

ER -

The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture

Abstract

Keywords

ASJC Scopus subject areas

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