The effect of pre-existing voids on solder reliability at different thermomechanical stress Levels: Experimental assessment

Muhammed Waseem, Mesfin Seid Ibrahim, Chang Lu, Muhammed Waseem, Hiu Hung Lee, K. H. Loo

Research output: Journal article publicationJournal articleAcademic researchpeer-review

5 Citations (Scopus)

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Engineering