The effect of plasma etching process on rigid flex substrate for electronic packaging application

Keyphrases

• Surface Roughness 100%
• Electronic Packaging 100%
• Packaging Applications 100%
• Polymer Substrate 100%
• Plasma Etching Process 100%
• Rigid-flex Substrate 100%
• Plasma Treatment 50%
• Taguchi Method 50%
• Scanning Electron Microscopy 50%
• Chemical Changes 50%
• Process Cycles 50%
• Atomic Force Microscopy 50%
• Printed Circuit Board 50%
• Interfacial Properties 50%
• High Reliability 50%
• Optimum Parameters 50%
• Parameter Setting 50%
• Orthogonal Array 50%
• Physical Changes 50%
• Parameter Configuration 50%
• Parameter Analysis 50%
• High Reproducibility 50%
• Taguchi Experiment 50%
• High-speed Transmission 50%
• Plasma Etching 50%
• Rigid-flexible 50%
• Plasma-induced 50%
• Electrical Reliability 50%
• Maximum Information 50%
• Mechanical Reliability 50%
• Device Miniaturization 50%
• Traditional Uses 50%
• Optimal Process Conditions 50%
• Cycle Condition 50%
• Transmission Circuit 50%
• Device Packaging 50%
• Electronic Packaging Technology 50%
• Reliability Properties 50%

Engineering

• Etching Process 100%
• Polymer Substrate 100%
• Electronic Packaging 100%
• Hydrophobic 50%
• Subsurface 50%
• Plasma Treatment 50%
• Printed Circuit Board 50%
• Induced Change 50%
• Taguchi Method 50%
• Experimental Run 50%
• Optimal Process Condition 50%
• Trigger Circuit 50%
• Atomic Force Microscopy 50%

Material Science

• Surface Roughness 100%
• Plasma Etching 100%
• Electronic Circuit 100%
• Taguchi Method 50%
• Scanning Electron Microscopy 50%
• Interface Property 50%
• Surface (Surface Science) 50%