Abstract
Electrically conductive cotton fabrics were successfully prepared by a first free radical polymerization, assisted by a conventional pad-dry-cure textile technology and subsequent electroless deposition (ELD) of copper thin layers on cotton fiber surfaces. Pad-dry-cure takes a major role in the even uptake and penetration of the monomer [2-(methacryloyloxy)ethyl]trimethyl-ammonium chloride (METAC) solution throughout the cotton fabrics, making subsequent ELD plating of copper metal uniform. The surface electrical resistivity of as-prepared electro-conductive cotton fabrics varies from 103 to 10-1Ω/sq, depending on the ELD conditions. The whole process is low cost, low chemical wastage and compatible with current wet processing in the textile industry, which provides a great potential in commercialization in a bulk scale.
Original language | English |
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Pages (from-to) | 117-128 |
Number of pages | 12 |
Journal | Journal of Fiber Bioengineering and Informatics |
Volume | 6 |
Issue number | 2 |
DOIs | |
Publication status | Published - 3 Sept 2013 |
Keywords
- Cotton
- Electroless Deposition
- Electronic Textiles
- Pad-dry-cure
- Polymer Brushes
ASJC Scopus subject areas
- General Computer Science
- General Materials Science