Tensile strength of aluminium nitride films

Deng Gang Zong, Chung Wo Ong, Manju Aravind, Mei P.O. Tsang, Chung Loong Choy, Deren Lu, Dejun Ma

Research output: Journal article publicationJournal articleAcademic researchpeer-review

10 Citations (Scopus)

Abstract

Two-layered aluminium nitride (AlN)/silicon nitride microbridges were fabricated for microbridge tests to evaluate the elastic modulus, residual stress and tensile strength of the AlN films. The silicon nitride layer was added to increase the robustness of the structure. In a microbridge test, load was applied to the centre of a microbridge and was gradually increased by a nano-indenter equipped with a wedge tip until the sample was broken, while displacement was recorded coherently. Measurements were performed on single-layered silicon nitride microbridges and two-layered AlN/silicon nitride microbridges respectively. The data were fitted to a theory to derive the elastic modulus, residual stress and tensile strength of the silicon nitride films and AlN films. For the AlN films, the three parameters were determined to be 200, 0.06 and 0.3 GPa, respectively. The values of elastic modulus obtained were consistent with those measured by conventional nano-indentation method. The tensile strength value can be used as a reference to reflect the maximum tolerable tensile stress of AlN films when they are used in micro- electromechanical devices.
Original languageEnglish
Pages (from-to)3353-3373
Number of pages21
JournalPhilosophical Magazine
Volume84
Issue number31
DOIs
Publication statusPublished - 1 Nov 2004

ASJC Scopus subject areas

  • Condensed Matter Physics

Cite this