Temperature effect on adhesively bonded CFRP and steel double strap joints

Tien C. Nguyen, Yu Bai, Xiao Ling Zhao, M. R. Bambach, Riadh Al-Mahaidi

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

2 Citations (Scopus)

Abstract

Steel/CFRP double-strap joints adhesive-bonded by epoxy were tested in tension under different temperatures ranging between 20°C and 60°C. Effective bond length was experimentally determined at 20°C first. Specimens, varied with the effective, half and twice the effective bond length and with one or three carbon fibre layers, were examined under the specified temperature range. It was found that the ultimate load and the joint stiffness of all pecimens decreased significantly at temperatures near to Tg. Based on the kinetic modeling of glass transition of adhesive, a mechanism-based model was proposed to describe the strength and stiffness degradation of steel/CFRP double strap joints at elevated temperatures, and the modeling results were validated by the corresponding experimental measurements. In addition, it demonstrated that the effec-Tive bond length is increased with temperature.

Original languageEnglish
Title of host publicationAdvances in FRP Composites in Civil Engineering - Proceedings of the 5th International Conference on FRP Composites in Civil Engineering, CICE 2010
PublisherSpringer Berlin Heidelberg
Pages877-880
Number of pages4
ISBN (Print)9783642174865
DOIs
Publication statusPublished - 2011
Externally publishedYes
Event5th International Conference on FRP Composites in Civil Engineering, CICE 2010 - Beijing, China
Duration: 27 Sep 201029 Sep 2010

Publication series

NameAdvances in FRP Composites in Civil Engineering - Proceedings of the 5th International Conference on FRP Composites in Civil Engineering, CICE 2010

Conference

Conference5th International Conference on FRP Composites in Civil Engineering, CICE 2010
Country/TerritoryChina
CityBeijing
Period27/09/1029/09/10

ASJC Scopus subject areas

  • Surfaces and Interfaces

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