Temperature dependence of magnetic properties of a polymer bonded magnetic material

Wei Tai Wu, Y. W. Wong, Ka Wai Eric Cheng

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

2 Citations (Scopus)

Abstract

Polymer bonded magnetic materials have recently attracted increasing attention from fundamental research to industrial applications in many electromagnetic devices. It is necessary to investigate the properties of these magnetic materials operated under different environmental conditions. In particular, in this work, we investigated the relationship between the temperature and the magnetic properties of a polymer bonded magnetic material, epoxy (EP) resin bonded Co-Ni magnetic material. Experimental results indicate that the coercivity, the remanence magnetic flux density and the saturation magnetic flux density decrease at the elevated temperature. It is envisioned that the present studies may offer guidance for the applications of the polymer bonded magnetic material.
Original languageEnglish
Title of host publication2006 2nd International Conference on Power Electronics Systems and Applications, ICPESA
Pages73-76
Number of pages4
DOIs
Publication statusPublished - 1 Dec 2006
Event2006 2nd International Conference on Power Electronics Systems and Applications, ICPESA - Hong Kong, Hong Kong
Duration: 12 Nov 200614 Nov 2006

Conference

Conference2006 2nd International Conference on Power Electronics Systems and Applications, ICPESA
CountryHong Kong
CityHong Kong
Period12/11/0614/11/06

Keywords

  • Magnetic material
  • Magnetic property
  • Polymer bonded
  • Temperature

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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