Abstract
The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni-P deposits were studied. The results showed that the deposition rate of the Ni-P deposit and P content of the Ni-P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni-P deposits showed a nodule structure. The Ni-P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni-P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni-P plated polyester fabric was close to 45-50 dB when the surface resistance was 0.63 Ω/□.
| Original language | English |
|---|---|
| Pages (from-to) | 587-593 |
| Number of pages | 7 |
| Journal | Surface Review and Letters |
| Volume | 15 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 1 Oct 2008 |
Keywords
- Electroless Ni-P plating
- Electromagnetic interference shielding
- Microstructure
- Polyester fabric
- Surface resistance
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry