Temperature dependence of electroless Ni-P deposition on polyester fabric

R. H. Guo; S. Q. Jiang; C. W.M. Yuen; Man Ching Frankie Ng

doi:10.1142/S0218625X08011780

Temperature dependence of electroless Ni-P deposition on polyester fabric

R. H. Guo, S. Q. Jiang, C. W.M. Yuen, Man Ching Frankie Ng

The Hong Kong Polytechnic University

Research output: Journal article publication › Journal article › Academic research › peer-review

4 Citations (Scopus)

Abstract

The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni-P deposits were studied. The results showed that the deposition rate of the Ni-P deposit and P content of the Ni-P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni-P deposits showed a nodule structure. The Ni-P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni-P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni-P plated polyester fabric was close to 45-50 dB when the surface resistance was 0.63 Ω/□.

Original language	English
Pages (from-to)	587-593
Number of pages	7
Journal	Surface Review and Letters
Volume	15
Issue number	5
DOIs	https://doi.org/10.1142/S0218625X08011780
Publication status	Published - 1 Oct 2008

Keywords

Electroless Ni-P plating
Electromagnetic interference shielding
Microstructure
Polyester fabric
Surface resistance

ASJC Scopus subject areas

Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

More information

10.1142/S0218625X08011780

Cite this

@article{5843d998309b4ebd85f72d74a3cac885,

title = "Temperature dependence of electroless Ni-P deposition on polyester fabric",

abstract = "The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni-P deposits were studied. The results showed that the deposition rate of the Ni-P deposit and P content of the Ni-P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni-P deposits showed a nodule structure. The Ni-P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni-P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni-P plated polyester fabric was close to 45-50 dB when the surface resistance was 0.63 Ω/□.",

keywords = "Electroless Ni-P plating, Electromagnetic interference shielding, Microstructure, Polyester fabric, Surface resistance",

author = "Guo, {R. H.} and Jiang, {S. Q.} and Yuen, {C. W.M.} and Ng, {Man Ching Frankie}",

year = "2008",

month = oct,

day = "1",

doi = "10.1142/S0218625X08011780",

language = "English",

volume = "15",

pages = "587--593",

journal = "Surface Review and Letters",

issn = "0218-625X",

publisher = "World Scientific Publishing Co. Pte Ltd",

number = "5",

}

TY - JOUR

T1 - Temperature dependence of electroless Ni-P deposition on polyester fabric

AU - Guo, R. H.

AU - Jiang, S. Q.

AU - Yuen, C. W.M.

AU - Ng, Man Ching Frankie

PY - 2008/10/1

Y1 - 2008/10/1

N2 - The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni-P deposits were studied. The results showed that the deposition rate of the Ni-P deposit and P content of the Ni-P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni-P deposits showed a nodule structure. The Ni-P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni-P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni-P plated polyester fabric was close to 45-50 dB when the surface resistance was 0.63 Ω/□.

AB - The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni-P deposits were studied. The results showed that the deposition rate of the Ni-P deposit and P content of the Ni-P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni-P deposits showed a nodule structure. The Ni-P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni-P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni-P plated polyester fabric was close to 45-50 dB when the surface resistance was 0.63 Ω/□.

KW - Electroless Ni-P plating

KW - Electromagnetic interference shielding

KW - Microstructure

KW - Polyester fabric

KW - Surface resistance

UR - http://www.scopus.com/inward/record.url?scp=55849123265&partnerID=8YFLogxK

U2 - 10.1142/S0218625X08011780

DO - 10.1142/S0218625X08011780

M3 - Journal article

SN - 0218-625X

VL - 15

SP - 587

EP - 593

JO - Surface Review and Letters

JF - Surface Review and Letters

IS - 5

ER -

Temperature dependence of electroless Ni-P deposition on polyester fabric

Abstract

Keywords

ASJC Scopus subject areas

More information

Other files and links

Fingerprint

Cite this