Temperature dependence of electroless Ni-P deposition on polyester fabric

R. H. Guo, S. Q. Jiang, C. W.M. Yuen, Man Ching Frankie Ng

Research output: Journal article publicationJournal articleAcademic researchpeer-review

4 Citations (Scopus)


The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni-P deposits were studied. The results showed that the deposition rate of the Ni-P deposit and P content of the Ni-P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni-P deposits showed a nodule structure. The Ni-P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni-P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni-P plated polyester fabric was close to 45-50 dB when the surface resistance was 0.63 Ω/□.
Original languageEnglish
Pages (from-to)587-593
Number of pages7
JournalSurface Review and Letters
Issue number5
Publication statusPublished - 1 Oct 2008


  • Electroless Ni-P plating
  • Electromagnetic interference shielding
  • Microstructure
  • Polyester fabric
  • Surface resistance

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this