TY - JOUR
T1 - Systematic analysis on the chemical reaction to the material removal in bonnet polishing of fused silica glass
AU - Ke, Xiaolong
AU - Wu, Wei
AU - Zhong, Bo
AU - Wang, Tianyi
AU - Yuan, Song
AU - Wang, Zhenzhong
AU - Kim, Daewook
AU - Liu, Jianchun
AU - Li, Min
AU - Guo, Jiang
AU - Wang, Chunjin
N1 - Publisher Copyright:
© 2024 The Authors
PY - 2025/1
Y1 - 2025/1
N2 - Fused silica glass, known for its exceptional physical and chemical properties, is widely used across diverse industries. Cerium oxide (CeO2), a common polishing abrasive, is extensively employed in polishing fused silica surfaces. Studies have revealed that chemical reactions occur on fused silica surfaces during polishing processes with CeO2 abrasives. While these chemical reactions have been studied in the context of chemical-mechanical polishing on fused silica surfaces, the chemical impacts of employing a small, compliant polishing tool on fused silica surfaces remain unclear. In this study, we use CeO2 abrasive and alumina (Al2O3) abrasive as polishing slurries and utilize a bonnet tool to polish fused silica surfaces. Through a comparative analysis of the removal efficiency of the tool influence function, alterations in surface hardness, and the sub-surface damage layer, we found that the primary factor governing material removal is the chemical reactions between CeO2 and fused silica. These reactions effectively soften the fused silica molecule layers and contribute to rapid material removal. This research fills the knowledge gap regarding the chemical effects during bonnet polishing with CeO2 abrasive. It offers valuable insights for efficient material removal control in the context of bonnet polishing fused silica surfaces. These insights will also be applicable to other computer-controlled polishing processes for fused silica glass utilizing CeO2 slurry.
AB - Fused silica glass, known for its exceptional physical and chemical properties, is widely used across diverse industries. Cerium oxide (CeO2), a common polishing abrasive, is extensively employed in polishing fused silica surfaces. Studies have revealed that chemical reactions occur on fused silica surfaces during polishing processes with CeO2 abrasives. While these chemical reactions have been studied in the context of chemical-mechanical polishing on fused silica surfaces, the chemical impacts of employing a small, compliant polishing tool on fused silica surfaces remain unclear. In this study, we use CeO2 abrasive and alumina (Al2O3) abrasive as polishing slurries and utilize a bonnet tool to polish fused silica surfaces. Through a comparative analysis of the removal efficiency of the tool influence function, alterations in surface hardness, and the sub-surface damage layer, we found that the primary factor governing material removal is the chemical reactions between CeO2 and fused silica. These reactions effectively soften the fused silica molecule layers and contribute to rapid material removal. This research fills the knowledge gap regarding the chemical effects during bonnet polishing with CeO2 abrasive. It offers valuable insights for efficient material removal control in the context of bonnet polishing fused silica surfaces. These insights will also be applicable to other computer-controlled polishing processes for fused silica glass utilizing CeO2 slurry.
KW - Bonnet polishing
KW - Cerium oxide
KW - Chemical effect
KW - Fused silica
KW - Ultra-precision machining
UR - http://www.scopus.com/inward/record.url?scp=85211321098&partnerID=8YFLogxK
U2 - 10.1016/j.jmrt.2024.12.056
DO - 10.1016/j.jmrt.2024.12.056
M3 - Journal article
AN - SCOPUS:85211321098
SN - 2238-7854
VL - 34
SP - 249
EP - 258
JO - Journal of Materials Research and Technology
JF - Journal of Materials Research and Technology
ER -