TY - GEN
T1 - System-Level Thermal Modeling of a Modular Multilevel Converter
AU - Zhang, Yi
AU - Wang, Huai
AU - Wang, Zhongxu
AU - Blaabjerg, Frede
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/3
Y1 - 2020/3
N2 - In the thermal analysis of a Modular Multilevel Converter (MMC) system, one of the challenges is to model the heat sources and thermal paths across large spatial scales, i.e., from a tiny power semiconductor chip at square millimeters to the whole converter system up to several thousand cubic meters. Without good understanding of the dissimilarity of thermal behaviors under different spatial scales, conventional thermal models usually lead to either considerable modeling errors or heavy computational burden. In this paper, a hierarchical decomposition method is proposed to do the system-level thermal modeling of the MMC. At Sub-Module(SM) level, ethe junction/hotspot-to-local ambient thermal model of devices is established, where Thermal Cross-Coupling (TCC) effects among different devices in the SM are considered. At converter-level, thermal model is obtained to depict mutual European influences Unionamong the SMs in the MMC. A 15-kVA MMC prototype provides the experimental verifications at last.
AB - In the thermal analysis of a Modular Multilevel Converter (MMC) system, one of the challenges is to model the heat sources and thermal paths across large spatial scales, i.e., from a tiny power semiconductor chip at square millimeters to the whole converter system up to several thousand cubic meters. Without good understanding of the dissimilarity of thermal behaviors under different spatial scales, conventional thermal models usually lead to either considerable modeling errors or heavy computational burden. In this paper, a hierarchical decomposition method is proposed to do the system-level thermal modeling of the MMC. At Sub-Module(SM) level, ethe junction/hotspot-to-local ambient thermal model of devices is established, where Thermal Cross-Coupling (TCC) effects among different devices in the SM are considered. At converter-level, thermal model is obtained to depict mutual European influences Unionamong the SMs in the MMC. A 15-kVA MMC prototype provides the experimental verifications at last.
UR - https://www.scopus.com/pages/publications/85087747975
U2 - 10.1109/APEC39645.2020.9124434
DO - 10.1109/APEC39645.2020.9124434
M3 - Conference article published in proceeding or book
AN - SCOPUS:85087747975
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 2766
EP - 2771
BT - APEC 2020 - 35th Annual IEEE Applied Power Electronics Conference and Exposition
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 35th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2020
Y2 - 15 March 2020 through 19 March 2020
ER -