Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages

E. H. Wong; Ranjan Rajoo; Thiam Beng Lim; Yui Wing Mai

doi:10.1109/TCAPT.2005.850526

Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages

E. H. Wong, Ranjan Rajoo, Thiam Beng Lim, Yui Wing Mai

Research output: Journal article publication › Journal article › Academic research › peer-review

15 Citations (Scopus)

Abstract

Stress corrosion cracking and the associated time-dependent subcritical debonding of the underfill-die interface is believed to be responsible for a large disparity between the reliabilities of flip chip-underfill packages subjected to two different aging conditions: 1) 85 °C/85% RH (> 3500h) and 2) 121 °C/100% RH (∼ 100 h). The ratio of the transverse stress at the bump (Sy) to the shear stress at the die edge (Sxy) has been found to correlate well with the two characteristic autoclave failure signatures: random local failure and die edge delamination. The first failure mode is promoted by a high Sy-Sxy ratio. A practical finding from this study is that raising the curing temperature of the underfill offers a simple and effective means of enhancing the autoclave performance of the flip chip-underfill package.

Original language	English
Pages (from-to)	862-868
Number of pages	7
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	28
Issue number	4
DOIs	https://doi.org/10.1109/TCAPT.2005.850526
Publication status	Published - Dec 2005
Externally published	Yes

Keywords

Debonding
Hygroscopic swelling
Swelling
Temperature-humidity (T-H) aging

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

More information

10.1109/TCAPT.2005.850526

Cite this

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title = "Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages",

abstract = "Stress corrosion cracking and the associated time-dependent subcritical debonding of the underfill-die interface is believed to be responsible for a large disparity between the reliabilities of flip chip-underfill packages subjected to two different aging conditions: 1) 85 °C/85% RH (> 3500h) and 2) 121 °C/100% RH (∼ 100 h). The ratio of the transverse stress at the bump (Sy) to the shear stress at the die edge (Sxy) has been found to correlate well with the two characteristic autoclave failure signatures: random local failure and die edge delamination. The first failure mode is promoted by a high Sy-Sxy ratio. A practical finding from this study is that raising the curing temperature of the underfill offers a simple and effective means of enhancing the autoclave performance of the flip chip-underfill package.",

keywords = "Debonding, Hygroscopic swelling, Swelling, Temperature-humidity (T-H) aging",

author = "Wong, {E. H.} and Ranjan Rajoo and Lim, {Thiam Beng} and Mai, {Yui Wing}",

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doi = "10.1109/TCAPT.2005.850526",

language = "English",

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Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages. / Wong, E. H.; Rajoo, Ranjan; Lim, Thiam Beng et al.
In: IEEE Transactions on Components and Packaging Technologies, Vol. 28, No. 4, 12.2005, p. 862-868.

Research output: Journal article publication › Journal article › Academic research › peer-review

TY - JOUR

T1 - Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages

AU - Wong, E. H.

AU - Rajoo, Ranjan

AU - Lim, Thiam Beng

AU - Mai, Yui Wing

PY - 2005/12

Y1 - 2005/12

N2 - Stress corrosion cracking and the associated time-dependent subcritical debonding of the underfill-die interface is believed to be responsible for a large disparity between the reliabilities of flip chip-underfill packages subjected to two different aging conditions: 1) 85 °C/85% RH (> 3500h) and 2) 121 °C/100% RH (∼ 100 h). The ratio of the transverse stress at the bump (Sy) to the shear stress at the die edge (Sxy) has been found to correlate well with the two characteristic autoclave failure signatures: random local failure and die edge delamination. The first failure mode is promoted by a high Sy-Sxy ratio. A practical finding from this study is that raising the curing temperature of the underfill offers a simple and effective means of enhancing the autoclave performance of the flip chip-underfill package.

AB - Stress corrosion cracking and the associated time-dependent subcritical debonding of the underfill-die interface is believed to be responsible for a large disparity between the reliabilities of flip chip-underfill packages subjected to two different aging conditions: 1) 85 °C/85% RH (> 3500h) and 2) 121 °C/100% RH (∼ 100 h). The ratio of the transverse stress at the bump (Sy) to the shear stress at the die edge (Sxy) has been found to correlate well with the two characteristic autoclave failure signatures: random local failure and die edge delamination. The first failure mode is promoted by a high Sy-Sxy ratio. A practical finding from this study is that raising the curing temperature of the underfill offers a simple and effective means of enhancing the autoclave performance of the flip chip-underfill package.

KW - Debonding

KW - Hygroscopic swelling

KW - Swelling

KW - Temperature-humidity (T-H) aging

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JO - IEEE Transactions on Components and Packaging Technologies

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IS - 4

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Swelling and time-dependent subcritical debonding of underfill during temperature-humidity aging of flip chip packages

Abstract

Keywords

ASJC Scopus subject areas

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