Surface generation mechanism of WC/Co and RB-SiC/Si composites under high spindle speed grinding (HSSG)

Quanli Zhang, Suet To, Qingliang Zhao, Bing Guo

Research output: Journal article publicationJournal articleAcademic researchpeer-review

21 Citations (Scopus)


The surface generation mechanisms of WC/Co and Reaction-bonded SiC/Si (RB-SiC/Si) composites under high spindle speed grinding (HSSG) were investigated in the present work, compared with quasi-static indentation test. The results showed that surface generation mechanism for WC/Co and RB-SiC/Si varied under both quasi-static indentation and dynamic grinding. Only plastic deformation occurred for WC/Co indicating its higher toughness, while pop-out effect induced by phase transformation in RB-SiC/Si would prompt the chipping at phase boundaries under indentation. Under dynamic grinding, WC/Co underwent plastic deformation, grain dislodgement and WC particles crush, while ductile removal, phase boundaries crack (along the grinding direction) and chipping fracture occurred for RB-SiC/Si with the increase of cutting depth. It was found that the binder in the bulk WC/Co and RB-SiC/Si played a decisive role on the material removal mode, and the mechanics of grain dislodgement for WC/Co and RB-SiC/Si were analyzed based on a geometrical model. Besides, three types of grinding wheel wear appeared, including grit dislodgement, flattening and splintering, which bear an obvious influence on the surface generation.
Original languageEnglish
Pages (from-to)123-131
Number of pages9
JournalInternational Journal of Refractory Metals and Hard Materials
Publication statusPublished - 1 Apr 2016


  • Composites
  • High spindle speed grinding
  • Surface generation mechanism
  • Wheel wear

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry


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