Surface Finish Optimization in Pulse Reverse Current Electroforming

Kam Po Wong, Kang Cheung Chan, Tai Man Yue

Research output: Publication in policy / professional / specialist journalArticle (for policy / professional audience)Academic researchpeer-review

6 Citations (Scopus)


The application of pulse reverse current in electroforming is known to result in better surface finishing. Nevertheless, it seems impractical to obtain an optimum surface finish by trial and error methods, as the process itself involves a number of variables. In this study, a Taguchi method was successfully applied to identify the dominant factors in controlling surface roughness. Moreover, an optimum surface finish for electroforming of nickel under the conditions of pulse reverse current was determined. The results show that the positive peak current density and the anodic time were the two most critical factors. The optimum surface finish (ΔR) obtained was 0.05 m; this occurred at a positive peak current density of 870 mA/cm2, an off time of 3 msec, an on time of 5 msec and a negative peak current density of 650 mA/cm2.
Original languageEnglish
Number of pages5
Specialist publicationPlating and Surface Finishing
Publication statusPublished - 1 May 1999

ASJC Scopus subject areas

  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry


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