Surface damage mechanism of monocrystalline silicon during single point diamond grinding

Keyphrases

• Surface Damage 100%
• Damage Mechanism 100%
• Single Point 100%
• Diamond Grinding 100%
• Monocrystalline Silicon 100%
• Diamond Grits 66%
• Chemical Reaction 33%
• Machining Process 33%
• Ultra-precision Machining 33%
• Oxidation Reaction 33%
• O Atom 33%
• N Atoms 33%
• Si(111) 33%
• Kinematics 33%
• Dynamic Pressure 33%
• Raman Spectroscopy 33%
• Si-N 33%
• Surface Oxidation 33%
• Si-C 33%
• Amorphization 33%
• Graphite Oxide 33%
• Tool Wear Mechanism 33%
• Ductile Material Removal 33%
• Diamond Wheel 33%
• XRD Spectroscopy 33%
• Brittle Material Removal 33%
• High-pressure Phase 33%
• Single-crystalline 33%
• Crystalline Si 33%

Engineering

• Damage Mechanism 100%
• Diamond Grit 100%
• Diamond Grinding 100%
• Monocrystalline Silicon 100%
• Material Removal 50%
• Damage Surface 50%
• Pressure Phase 50%
• Grinding (Machining) 50%
• Diamond 50%
• Dynamic Pressure 50%
• Graphite Oxide 50%
• Brittleness 50%