Super-resolution imaging with occlusion removal using a camera array

Tingtian Li, Pak Kong Lun

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

7 Citations (Scopus)

Abstract

In this paper, a novel algorithm which combines the super-resolution imaging and occlusion removal into a single and automatic procedure is proposed. By utilizing the visual parallax of objects at different depths and the sub-pixel information of the images captured by a camera array, we can estimate the shape of the occlusion and reconstruct the background at a higher resolution iteratively. The occlusion shape estimation is achieved by a new method called seed growth, which treats the detected feature points of the occlusion as seeds. These seeds will gradually grow until they reach the occlusion boundary. Experimental results show that the proposed algorithm can well remove the occlusion while super-resolving the background. It performs equally well when there are multiple occlusion objects or the object has irregular shape.
Original languageEnglish
Title of host publicationISCAS 2016 - IEEE International Symposium on Circuits and Systems
PublisherIEEE
Pages2487-2490
Number of pages4
Volume2016-July
ISBN (Electronic)9781479953400
DOIs
Publication statusPublished - 29 Jul 2016
Event2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal's Sheraton Centre, Montreal, Canada
Duration: 22 May 201625 May 2016

Conference

Conference2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
Country/TerritoryCanada
CityMontreal
Period22/05/1625/05/16

Keywords

  • camera array
  • occlusion removal
  • seed growth
  • super-resolution imaging

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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