Substrate bias dependence of the structure and internal stress of TiN films deposited by the filtered cathodic vacuum arc

Y. H. Cheng, B. K. Tay, Shu Ping Lau

Research output: Journal article publicationJournal articleAcademic researchpeer-review

13 Citations (Scopus)


TiN films were deposited by a new offplane double bend filtered cathodic vacuum arc technique at low deposition pressure with a very high deposition rate. The surface morphology, structure, and internal stress in the deposited films were strongly dependent on the substrate bias. As substrate bias was increased to -100 V, the surface roughness decreased to a minimum, the preferred orientation changed gradually from (200) to (111), and the internal stress increased to a maximum. At a bias above -200 V, a decrease of lattice perfection and increase of lattice defect density with substrate bias were clearly observed.
Original languageEnglish
Pages (from-to)1327-1331
Number of pages5
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Issue number4
Publication statusPublished - 1 Jul 2002
Externally publishedYes

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

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