Skip to main navigation Skip to search Skip to main content

Sub-pixel image correlation: An alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages

  • Jason Y L Goh
  • , Mark C. Pitter
  • , Chung W. See
  • , Michael Geoffrey Somekh
  • , Daniel Vanderstraeten

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Fingerprint

Dive into the research topics of 'Sub-pixel image correlation: An alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages'. Together they form a unique fingerprint.
Sort by

Keyphrases

Engineering

Material Science