Study on thermal interface material with carbon nanotubes and carbon black in high-brightness LED packaging with flip-chip technology

Kai Zhang, Guo Wei Xiao, Cell K.Y. Wong, Hong Wei Gu, Matthew M.F. Yuen, Philip Ching Ho Chan, Bing Xu

Research output: Journal article publicationConference articleAcademic researchpeer-review

48 Citations (Scopus)

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