Study on the machining mechanism of WEDM with ultrasonic vibration of the wire

Z. N. Guo, T. C. Lee, Tai Man Yue, W. S. Lau

Research output: Journal article publicationJournal articleAcademic researchpeer-review

30 Citations (Scopus)

Abstract

WEDM assisted by ultrasonic vibration of the wire has a better machining result than that cf wire cut alone. In order to study its machining mechanism, the methods of experiment as well as simulation have been used to verify some hypotheses and interpretation. By means of experiments employing single pulse discharge it has been established that the high frequency vibration of the wire electrode is able to bring about multiple channel discharges so that better surface quality and a high cutting rate can be obtained simultaneously. The simulation of the dynamic characteristics of the wire electrode under the action of continuous discharge forces shows that ultrasonic vibration facilitates the shift of the discharge points and improves their distribution. A set of statistical experiments has been designed to analyzed the utilization of the pulse. It is revealed that with ultrasonic vibration there is a greater utilization of energy, which is a critical factor in securing an increase in the cutting rate.
Original languageEnglish
Pages (from-to)212-221
Number of pages10
JournalJournal of Materials Processing Technology
Volume69
Issue number1-3
DOIs
Publication statusPublished - 1 Jan 1997

Keywords

  • Machining
  • Ultrasonic vibration
  • WEDM
  • Wire

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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