Study on the dielectric properties of hybrid and porous polyimide-silica films

Yihe Zhang, Qingsong Su, Li Yu, Hong Zheng, Haitao Huang, Guoge Zhang, Yingbang Yao, H. L.W. Chan

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

2 Citations (Scopus)

Abstract

A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1 μm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.
Original languageEnglish
Title of host publicationMulti-functional Materials and Structures - International Conference on Multifunctional Materials and Structures
PublisherTrans Tech Publications
Pages973-976
Number of pages4
ISBN (Print)0878493786, 9780878493784
Publication statusPublished - 1 Jan 2008
EventMulti-functional Materials and Structures - International Conference on Multifunctional Materials and Structures - Hong Kong, P.R., Hong Kong
Duration: 28 Jul 200831 Jul 2008

Publication series

NameAdvanced Materials Research
Volume47-50 PART 2
ISSN (Print)1022-6680

Conference

ConferenceMulti-functional Materials and Structures - International Conference on Multifunctional Materials and Structures
CountryHong Kong
CityHong Kong, P.R.
Period28/07/0831/07/08

Keywords

  • Dielectric constant
  • Polyimide
  • Porous and hybrid film
  • Silica

ASJC Scopus subject areas

  • Engineering(all)

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