A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1 μm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.
|Name||Advanced Materials Research|
|Volume||47-50 PART 2|
|Conference||Multi-functional Materials and Structures - International Conference on Multifunctional Materials and Structures|
|City||Hong Kong, P.R.|
|Period||28/07/08 → 31/07/08|
- Dielectric constant
- Porous and hybrid film