Study of a new capillary active bio-insulation material by hygrothermal simulation of multilayer wall

Muhammad Riaz Ahmad, Bing Chen, Yierfan Maierdan, Syed Minhaj Saleem Kazmi, Muhammad Junaid Munir

Research output: Journal article publicationJournal articleAcademic researchpeer-review

10 Citations (Scopus)

Abstract

This paper studies the influence of a new bio-based capillary active insulation (CAI) materials (corn stalk based vegetal derived concrete namely CS-1 and CS-2) and two traditional insulation materials (aerated autoclaved concrete (AAC) and aerated insulation brick (IB)) on the hygrothermal properties of multilayer wall. The reference wall consists of solid brick masonry plastered on the internal and external sides. Walls based on CAI materials consist of an extra layer of insulation and weather-resistive barrier (WRB) on the façade surface. Simulations were performed under the natural climatic condition of hot-humid and cold regions. Optimum thickness for the bio-based CAI materials to be used as internal insulation was 100 mm beyond which higher insulation thickness triggered the risk of mould growth. All walls based on CAI insulation materials (CS-1, CS-2, AAC, and IB) showed the mould index (MI) within the acceptable range. Bio-based CAI materials showed considerable improvement in the temperature and relative humidity at the interior surface. CAI materials reduced the heat losses through the wall by 58–69% as compared to the reference wall. Drying behavior of the wall was significantly improved with the combination of CAI and WRB and no risk of condensation was observed in the walls.

Original languageEnglish
Article number110724
JournalEnergy and Buildings
Volume234
DOIs
Publication statusPublished - 1 Mar 2021
Externally publishedYes

Keywords

  • Capillary active insulation
  • Heat loss
  • Indoor air quality
  • Mould risk
  • Thermal comfort

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Building and Construction
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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