Studies of copper vacuum arc plasma through an off-plane double-bend filtering duct

B. K. Tay, G. F. You, J. X. Guo, G. Q. Yu, Shu Ping Lau

Research output: Journal article publicationJournal articleAcademic researchpeer-review

3 Citations (Scopus)

Abstract

A novel off-plane double-bend (OPDB) magnetic filter, designed to remove unwanted macroparticles effectively from the plasma beam of a cathodic vacuum arc, was used in our filtered vacuum arc system to deposit copper thin film as an interconnect material for deep submicron IC applications. A filter with high plasma transmission efficiency is essential for a high deposition rate, which is key to the commercialisation of the technology. Hence, an investigation has been carried out to study the copper arc plasma under varying magnetic field and duct bias. The ion throughput was determined by measuring the ion saturation output current using a copper disc probe. To study further the copper ion motion in the OPDB filter, a modified drift model was applied, which took into account radial electric fields generated by the potential difference between the duct wall and torus centre. Relatively good agreement between the experimental and simulation results were obtained.
Original languageEnglish
Pages (from-to)482-486
Number of pages5
JournalSurface and Coatings Technology
Volume169-170
DOIs
Publication statusPublished - 2 Jun 2003
Externally publishedYes

Keywords

  • Copper
  • Ion saturation current
  • Off-plane double-bend filter
  • Plasma simulation
  • Vacuum arc plasma

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this