Structural and electrical properties of copper thin films prepared by filtered cathodic vacuum arc technique

J. R. Shi, Shu Ping Lau, Z. Sun, X. Shi, B. K. Tay, H. S. Tan

Research output: Journal article publicationJournal articleAcademic researchpeer-review

36 Citations (Scopus)

Abstract

Copper thin films with low electrical resistivity were successfully deposited by filtered cathodic vacuum are technique at room temperature. The structure of the films was determined by X-ray diffraction, TEM and atomic force microscopy. All the copper films had a polycrystalline structure. The RMS roughness, the lateral size and the grain size all increased with increasing film thickness. There is a critical film thickness of approximately 135 nm. The electrical resistivity had an almost unchanged value of 1.8 μΩ cm. above 135 nm and increased with decreasing thickness below 135 nm.
Original languageEnglish
Pages (from-to)250-255
Number of pages6
JournalSurface and Coatings Technology
Volume138
Issue number2-3
DOIs
Publication statusPublished - 16 Apr 2001
Externally publishedYes

Keywords

  • Copper
  • Filtered cathodic vacuum arc

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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