@inproceedings{e97da2f9587c4c5cbb848cf0ada94de2,
title = "Stress-strain simulation of solder joints in a BGA package",
abstract = "A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder joints in a ball grid array (BGA) package under temperature cycling. The effects of constraint on print circuit board (PCB) and stiffness of substrate on the deformation behaviour of the solder joints were also studied The results indicated that high inelastic strain was developed in the joints close to the package center. On the other hand, high constraint was associated with the joint closest to the edge of the silicon chip. Increasing external constraint on the PCB caused a slight increase in stress triaxiality in the joint closest to the edge of silicon chip. There was an increase of inelastic strain in the solder joints with increasing the Young's modulus of the substrate.",
keywords = "Capacitive sensors, Electronic packaging thermal management, Electronics packaging, Finite element methods, Plastics, Silicon, Soldering, Temperature, Thermal loading, Thermal stresses",
author = "Cheng Yan and Mai, {Yiu Wing} and Lin Ye",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th International Conference on Electronic Packaging Technology, ICEPT 2003 ; Conference date: 28-10-2003 Through 30-10-2003",
year = "2003",
doi = "10.1109/EPTC.2003.1298694",
language = "English",
series = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "65--69",
editor = "Keyun Bi and Barnwell, {Peter G.} and Jiaji Wang",
booktitle = "ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings",
}