Stress analysis of shape memory alloy composites

Yulong Wang, Li Min Zhou, Zhenqing Wang, Haitao Huang, Lin Ye

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

2 Citations (Scopus)


Shape memory alloys (SMAs), when in the form of wires or short fibers, can be embedded into a host material to form SMA-composite for satisfying a wide variety of engineering requirements. Due to the weak interface strength between the SMA wire and the matrix, the interface debonding often happens when the SMA composites act by external force or actuation temperature or combination of them. It is, therefore, very important to understand the stress transfers between the SMA fibers and matrix and the distributions of internal stresses in the SMA composite in order to improve its properties. In this paper, a theoretical model incorporated with Brinson's constitutive law of SMA for the prediction of internal stresses has been successfully developed. The assumed stress functions which satisfy equilibrium equations in the fiber and matrix respectively and the principle of minimum complementary energy are utilized to analyze the internal stress distributions during fiber pull-out and/or thermal loading processes. The complete axisymmetric states of stresses in the SMA fiber and matrix have been developed. A finite element analysis has been also conducted to compare with the theoretical results.
Original languageEnglish
Title of host publication2nd International Conference on Smart Materials and Nanotechnology in Engineering
Publication statusPublished - 22 Dec 2009
Event2nd International Conference on Smart Materials and Nanotechnology in Engineering - Weihai, China
Duration: 8 Jul 200911 Jul 2009


Conference2nd International Conference on Smart Materials and Nanotechnology in Engineering


  • Finite element analysis
  • Interfacial shear strength
  • Principle of minimum complementary energy
  • SMA composites
  • Stress function method

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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